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Wire Bond Process Engineer
Wire Bond Process Engineer
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Everything You Need to Know About Wire Bonding
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Professor Mahesh Podcast on Instagram: "How Chip Packaging Evolved: From Wire Bond to Flip-Chip In this clip, Dr. Gaurang Choksi explains the fascinating evolution of semiconductor packaging — from the earliest wire-bond technologies to today’s advanced flip-chip methods. He describes how chips with just 10–20 connections were once attached to simple lead frames using wire bonding, a technique that is still widely used in many power devices and motherboard components. But as chips demanded more
Instagram
profmaheshpodcast
1.8K views
1 month ago
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