Abstract: In this letter, a wideband and highly integrated Doherty power amplifier (PA) module for 5G massive MIMO (mMIMO) base station transceivers (BTSs) is presented, leveraging a novel GaN-on-Si ...
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Infineon Technologies has expanded its 7th generation TRENCHSTOP™ IGBT7 product family to include the CIPOS™ Maxi Intelligent Power Module (IPM) series for low-power motor drives. The new IM12BxxxC1 ...
Large-area sintering is proven to have benefits of improved thermal resistance and reliability. Traditionally, silicon power devices like IGBTs or MOSFETs were soldered onto the metal-ceramic ...
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