AUSTIN, Texas — LSI Logic Corp. has developed a form of wire bond packaging that places the bonding pads directly on top of the active I/O circuitry on the silicon. The move could extend the reach and ...

With nearly $330,000 in funding from NSF, mechanical engineering Assistant Professor Panthea Sepehrband and a group of undergraduate, master's, and Ph.D. students have teamed up with K&S, a leading ...

Several years ago, many predicted the demise of an older interconnect packaging technology called wire bonding, prompting the need for more advanced packaging types. Those predictions were wrong. The ...

Taiwan's top OSAT company ASE Technology Holding has been stepping up its purchases of more automated wire-bonding packaging machines to expand capacity for clients, while also enhancing its smart ...