Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources. Samsung has ...

SAN JOSE — A consortium of chip-equipment makers here today announced a major deal with Ace Semiconductor to help set up the world's first wafer-level packaging production line in China. Under the ...

This study investigates creation of 1.0µm RDL structures by a damascene process utilizing a photosensitive permanent dielectric material. The advantage of the photosensitive dielectric approach is ...

(Nanowerk News) Imec engineers have, for the first time, demonstrated the fabrication of extremely small sealed cavities (less than one picoliter in volume), fabricated directly on 200mm silicon ...

Delo is proposing low-viscosity UV-curable moulding compounds for FOWLP – fan-out wafer-level packaging. “With the use of UV-curable molding materials instead of heat curing ones, warpage and die ...

Moore’s Law has shifted toward advanced packaging over the past few years, but the limits of that approach are just now ...

Moore’s Law in process technology is on its last legs, so advanced packaging is taking up the baton. Advanced techniques such as fan-out wafer-level packaging (FOWLP) allow increased component density ...

Recognizing the strategic importance of semiconductor packaging technology, the South Korean government is reportedly initiating a major packaging technology R&D project aimed at assisting companies ...

Detailed price information for Acm Research Inc (ACMR-Q) from The Globe and Mail including charting and trades.

Charlotte, N.C., Feb. 01, 2021 (GLOBE NEWSWIRE) -- Akoustis Technologies, Inc. (NASDAQ: AKTS) (“Akoustis” or the “Company”), an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW ...

KLA KLAC is benefiting from strong spending in the Wafer Fabrication Equipment (“WFE”) market. The company expects the WFE ...