SANTA CLARA, CA, U.S. – September 19, 2023 – Astera Labs today said its Leo Memory Connectivity Platform is the industry’s first Compute Express Link (CXL) memory controller that increases server ...

JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls.

SAN JOSE, Calif.--(BUSINESS WIRE)--Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced the industry’s first HBM4 Memory Controller IP, ...

Integrated circuit company Montage Technology has launched its CXL 3.1 Memory eXpander Controller (MXC), which is currently being tested by some of its key customers, including AMD and Intel. The ...

Delivering unrivaled memory bandwidth in a compact, high-capacity footprint, has made HBM the memory of choice for AI/ML and other high-performance computing workloads. HBM3 as the latest generation ...

AI training data sets are constantly growing, driving the need for hardware accelerators capable of handling terabyte-scale bandwidth. Among the array of memory technologies available, High Bandwidth ...

We’re on the verge of a new era of computing that will likely see major changes to the data center, thanks to the growing dominance of artificial intelligence (AI) and machine learning (ML) ...

Sometime in 2027 to 2028, AMD could release Medusa Halo, its next-gen entry in the high-performance Halo APU lineup. It's said to feature Zen 6 CPU cores and RDNA 5 graphics. A new leak suggests it ...

Intel recently demonstrated a new type of DIMM memory technology called Multiplexer Combined Rank (MCR), also referred to as MRDIMMs, that provides up to 2.3X better performance for HPC workloads and ...

Montage delivers versatile memory solutions that unlock next-gen memory bandwidth and performance, specifically tailored for AI and data-intensive workloads. These solutions are already in use by ...