Epoxy adhesives have an unmatched record and an extensive 30-year history of bonding experiences. They combine high mechanical strength properties with dimensional stability, chemical resistance and ...

Master Bond LED422DC90 is a one component, nanosilica filled dual cure adhesive system engineered for high-speed fixturing and bonding of opaque substrates. This unique “side-bonding” capability ...

Master Bond Inc. single component EP17HT-3 epoxy adhesive cures in 2-3 minutes at 250-300°F. It requires no mixing and is capable of service up to 400°F. 100% reactive EP17HT-3 contains no solvents or ...

Electronic device design and production processes are experiencing an evolution. Devices are becoming increasingly more complex and smaller in size, with trends in functionalities and aesthetics ...

Master Bond Supreme 17HTND-2 is a toughened epoxy system for bonding and sealing applications. It is a true one component system, not premixed and frozen, with an unlimited working life at room ...