Business competition pressures manufacturers to produce faster, reduce expenses, and increase efficiencies. But all these requirements run into the quality control issue sooner or later — with the ...

Ultra Fast 20Gbps USB 3.2 Gen 2×2 Camera Type C | Onsemi AR1335 Color Camera | ROI Based Autofocus and Auto Exposure | ...

BEIJING, Aug. 31, 2023 /PRNewswire/ -- WiMi Hologram Cloud Inc. (NASDAQ: WIMI) ("WiMi" or the "Company"), a leading global Hologram Augmented Reality ("AR") Technology provider, today announced that ...

The first SWIR line scan camera from Teledyne DALSA offers up to 74 dB dynamic range and spectral response from 950 to 1700 nm With exceptional responsivity and low noise, this newest Linea SWIR line ...

Borescopic visual inspection may be appropriate for small parts with areas not visible to the naked eye. Even with all the high-tech testing and inspection techniques in use today, basic visual ...

Teledyne DALSA introduces its Linea ML 8k multispectral CLHS line scan camera for improved defect detectability with a single scan. Teledyne DALSA, a Teledyne Technologies [NYSE:TDY] company, is ...

MILPITAS, Calif.--(BUSINESS WIRE)--Today KLA-Tencor Corporation (NASDAQ:KLAC), the world’s leading supplier of process control and yield management solutions for the semiconductor and related ...

Manufacturers of aviation engine components are being impacted by Industry 4.0's emphasis on quality control. Industry 4.0 is challenging these manufacturers to rethink outdated QC processes and ...

Wafers can be inspected for large, obvious defects, or for small, subtle ones. The former is referred to as macro-inspection, while the latter is micro-inspection. These processes use different ...