The downsizing trend of devices gives rise to continuous demands of increasing input/output (I/O) and circuit density, and these needs encourage the development of a High-Density Fan-Out (HDFO) ...
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Two case studies show the effectiveness of high-res 3D ...
Radio Design Labs and its new majority owner Vopne Capital have named Erik Tarkiainen as RDL’s president. He succeeds company founder Joel Bump, who will remain with the business focused on product ...
Fan-out wafer-level packaging (FOWLP) is a key enabler in the industry shift from transistor scaling to system scaling and integration. The design fans out the chip interconnects through a ...
SEOUL, South Korea, July 15, 2025 /PRNewswire/ -- SK keyfoundry, an 8-inch pure-play foundry in Korea, announced today that it has successfully co-developed core technology and completed reliability ...
SK keyfoundry, an 8-inch pure-play foundry in Korea, has successfully co-developed core technology and completed reliability testing of Direct RDL (Redistribution Layer) – a core semiconductor ...
Radio Design Labs (“RDL”) welcomed audio industry executive Erik Tarkiainen as its new president. Tarkiainen’s successful history as an executive in the audio industry includes his most recent ...
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