Nasdaq

ACM Research Launches Stress-Free Polishing Tool for Advanced Packaging Applications; Delivers First Tool to Leading Chinese OSAT

FREMONT, Calif., March 18, 2020 (GLOBE NEWSWIRE) -- ACM Research, Inc. (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging ...
Nasdaq

ACM Research Highlights Availability of Portfolio of Wafer-Level Packaging Processing Equipment for OSAT Customers

Extensive Array of Back-End and Advanced Packaging Wet Wafer Process Equipment Leverages ACM’s Experience to Address Emerging Requirements for Wafer-Level Packaging FREMONT, Calif., Oct. 15, 2020 ...
EDN

Asymtek joins wafer-level packaging consortium

CARLSBAD, Calif.–Asymtek Inc., a supplier of automated fluid dispensing equipment for IC makers, here announced that it has joined the Advanced Packaging & Interconnect Alliance (APiA). Formed in late ...
Digi Times

Samsung steps up fan-out wafer-level packaging deployment

Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources. Samsung has ...
Business Wire

Global Fan-out Wafer Level Packaging (FOWLP) Market 2019-2023 | 16% CAGR Projection Through 2023 | Technavio

LONDON--(BUSINESS WIRE)--The global fan-out wafer level packaging (FOWLP) market is expected to post a CAGR of almost 16% during the period 2019-2023, according to the latest market research report by ...
EDN

STATS expands wafer-level packaging output

SAN JOSE, Calif. — Citing renewed demand, Singapore's STATS ChipPAC Ltd. is expanding its capacity for wafer-level packaging. STATS ChipPAC has been on a production ramp with wafer-level packaging ...
Seeking Alpha

ACM Research Strengthens its Fan-Out Panel Level Packaging Portfolio with Launch of Ultra ECP ap-p Tool

FREMONT, Calif., Aug. 07, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACMR) (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging ...
Semiconductor Engineering

The Next Advanced Packages

Packaging houses are readying their next-generation advanced IC packages, paving the way toward new and innovative system-level chip designs. It’s a confusing landscape with a plethora of buzzwords ...
DIGITIMES

Trymax ?? Plasma-based etching, stripping and curing process equipment maker

Trymax Semiconductor B.V. provides plasma-based etching, stripping, and curing process equipment for advanced semiconductor ...
Electronic Design

Die Products: Ideal IC Packaging For Demanding Applications

Advanced packaging that’s no bigger than the die itself brings together high performance and high reliability with small size and low cost. Not so long ago, defense and aerospace applications were the ...
Semiconductor Engineering

Next Steps For Panel-Level Packaging

Tanja Braun, group manager at Fraunhofer Institute for Reliability and Microintegration (IZM), sat down with Semiconductor Engineering to talk about III-V device packaging, chiplets, fan-out and panel ...