Just before fabrication, the design flow of all integrated circuits (ICs) culminates in transistor-based, top-level simulations. Unfortunately, verifying functionality, connectivity, and performance ...

Almost every chip being taped out today is mixed-signal in nature. In addition to increased integration of analog and RF blocks, designers are using complex power-management techniques to minimize ...

WEST LAFAYETTE, Ind. - A simulation of electrical current moving through a futuristic electronic transistor has been modeled atom-by-atom in less than 15 minutes by Purdue University researchers. The ...

Nothing is worse for a design team than a chip that fails to work in the bringup lab. Electrical problems are historically a major cause of such failures. Power leaks, power-ground DC paths, missing ...

Three years ago, I wrote a blog entitled “Linking Virtual Wafer Fabrication Modeling with Device-level TCAD Simulation,” in which I described the seamless connection between the SEMulator3D virtual ...

As the digital semiconductor manufacturing process moves into the FinFET era, more and more front-end-of-line (FEOL) defects are observed due to extremely small feature size and complex manufacturing ...

SAN JOSE, Calif. and YOKOHAMA, Japan, Nov. 30, 2010 (GLOBE NEWSWIRE) -- Magma® Design Automation Inc. (Nasdaq:LAVA), a provider of chip design software, announced today that Toshiba Corporation, a ...

Before a chip design is turned from a hardware design language (HDL) like VHDL or Verilog into physical hardware, testing and validating the design is an essential step. Yet simulating a HDL design is ...

China-based EDA leader Empyrean Technology and Shanghai UniVista Industrial Software Group have jointly announced their collaboration to build a digital-analog mixed design and simulation EDA solution ...

The different IBIS quality levels. The steps in the IBIS bench measurement procedure. Process for Quality Level 2a and Level 2b validation. The Input/Output Buffer Information Specification (IBIS) is ...