Heatsink technology has rapidly improved over the last few years. The introduction of heatpipes, use of large radius fans and the sophisticated mounting mechanisms have all aided these developments.

This whitepaper discusses the advantages of transient thermal test methods for IC package and thermal interface material (TIM) thermal characterization testing vs steady state methods. These methods ...

Hyundai-Kia America Technical Center (HATCI) and Forward Engineering North America LLC recently worked together to design a new method of testing thermal runaway performance in composite materials for ...

The TOPS (Thermo-Optical Plane Source) system represents a novel, cutting-edge approach for thermal conductivity measurements, offering a versatile, non-contact solution for analyzing a wide range of ...

Researchers at the US Department of Energy’s Argonne National Laboratory have unveiled a breakthrough ...

Due to their light weight and optimal mechanical properties, modern composite materials, such as carbon fiber-reinforced polymers (CFRP), are increasingly used in automotive, wind energy and ...

As the transistor density and switching speed of integrated circuits (ICs) increase and the package size decreases, the emerging generation of high-power ICs requires thermal management during testing ...

UL Solutions, a global company for applied safety science, has announced enhancements to the testing methods for battery energy storage systems (BESS). The new testing methods will address industry ...

Increasingly complex and heterogeneous architectures, coupled with the adoption of high-performance materials, are making it much more difficult to identify and test for thermal issues in advanced ...