TweakTown

Toshiba reveals memory breakthrough with TSV 3D NAND

Toshiba will leverage TSV (Through Silicon Via) technology to further boost data transfers and lower power consumption of its 3D BiCS VNAND TLC flash memory line. TSV's highly efficient vertical-based ...
SlashGear

Samsung 12-Layer 3D TSV Stacks 12 DRAM Chips In The Same Space As 8

Thanks to the laws of physics and Moore, there is only so much silicon we can fit in a single device. The challenge has always been to cram as many components as possible without increasing the amount ...
Business Wire

Samsung Electronics Develops Industry's First 12-Layer 3D-TSV Chip Packaging Technology

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it has developed the industry's first 12-layer 3D-TSV ...
Semiconductor Engineering

Low-Cost TSV Repair Architecture Specialized for Highly Clustered TSV Faults Within HBM

A new technical paper titled “Low Cost TSV Repair Architecture Using Switch-Based Matrix for Highly Clustered Faults” was published by researchers at Yonsei University. “Through-silicon via (TSV), ...
Nasdaq

ASE Announces FOCoS-Bridge With TSV; Latest Package Technology Reduces Power Loss by 3x for Next-Generation AI and HPC Applications

SUNNYVALE, Calif.--(BUSINESS WIRE)-- Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today ...
Semiconductor Engineering

Advanced Packaging for High-Bandwidth Memory: Influences of TSV size, TSV Aspect Ratio And Annealing Temperature

A technical paper titled “Stress Issue of Vertical Connections in 3D Integration for High-Bandwidth Memory Applications” was published by researchers at National Yang Ming Chiao Tung University. “The ...