In October 2023, 123 years after Toppan Printing was founded in Tokyo in 1900, the group was reorganized into a holding company structure with Toppan Inc. as the core operating company. Based on a ...

TSMC first developed its CoWoS package for advanced chips in 2012 and combined with HBM in 2016. The explosion of generative AI technology such as ChatGPT has been a catalyst for growth of TSMC’s ...

Fundamental to all digital technologies, semiconductor chips are a major focal point in twenty-first-century geoeconomic competition. Nations see it as an imperative to invest heavily in semiconductor ...

The United States is taking the first steps toward bringing larger-scale IC packaging production capabilities back to the U.S. as supply chain concerns and trade tensions grow. The U.S. is among the ...

The state-of-the-art topside cooling (GTPAK™) and gull-wing (GLPAK™) packages meet increased performance and robust environmental demands State-of-the-art topside cooling (GTPAK™) and gull-wing ...

Members can download this article in PDF format. Today, advances in semiconductors and ICs are producing ever smaller and denser circuits. With that comes the challenge of efficiently packaging and ...

Rising demand for chips is hitting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, leadframes and even some equipment. Spot shortages for some ...

The state-of-the-art topside cooling (GTPAK™) and gull-wing (GLPAK™) packages meet increased performance and robust environmental demands SUNNYVALE, Calif.--(BUSINESS WIRE)--Alpha and Omega ...