Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...

The semiconductor industry is at a pivotal moment as the limits of Moore’s Law motivate a transition to three-dimensional integrated circuit (3D IC) technology. By vertically integrating multiple ...

Manufacturing-aware system design treats dies, interposers, packages, and analysis as a single, coherent system.

Kaynes has also forged a significant partnership with global industrial software giant Siemens to enhance its system and package design capabilities, Panicker added. Under the collaboration, Kaynes ...

Copper interconnects cannot deliver the high-performance requirements of modern systems, especially with the rapid expansion of datacentre infrastructure. Co-Packaged Optics (CPO) offer an alternative ...

New subsidiary to focus on advanced semiconductor packaging for defence and strategic electronics – Paras would be setting up India’s first advanced heterogeneous & 3D packaging ...

Nvidia partnerships, $7B Arizona advanced packaging, 2026 growth catalysts & undervalued P/S vs. peers. Click here for more ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

The 3D-IC market outlook is entering a decisive phase as the semiconductor industry transitions beyond the limits of traditional Moore’s Law scaling. As performance, power efficiency, and system ...

Members can download this article in PDF format. Today, advances in semiconductors and ICs are producing ever smaller and denser circuits. With that comes the challenge of efficiently packaging and ...

The field of electronics, particularly integrated circuit (IC) technology, has advanced rapidly in recent years. With the development of 5G/6G mobile technology, semiconductor devices are evolving to ...

In today's fast-changing technological landscape, two key theories determine the future of semiconductor design: Moore's Law and the More-than-Moore approach. While Moore's Law focuses on increasing ...