Designed for AI accelerators, high-speed data center servers, and optical transceivers, PCBAIR's 8-layer Glass Core PCBs support finer line widths and spacing, with pilot production and customer ...
Driven by the explosion of big data and expanding applications, chip design complexity is increasing. Applications such as high-performance computing (HPC), the Internet of Things (IoT), automotive, ...
T-Works is getting a multi-layer printed circuit board (PCB) fabrication facility that can facilitate rapid fabrication of up to 12-layer boards, thus helping accelerate electronic product prototyping ...
Powered by Siemens’ PartQuest software, the RS DesignSpark Circuit Simulator is a cloud native environment for designing, modeling, simulating and analyzing circuits and systems. RS Group, a ...
State College, PA. Remcom has announced a new capability to import flexible printed-circuit-board (PCB) designs in the latest update to XFdtd 3D electromagnetic simulation software. The new release ...
SHENZHEN, China, Dec. 8, 2025 /PRNewswire/ -- PCBAIR announced the launch of its advanced 8-layer Glass Core PCB manufacturing capabilities, combining proprietary Through Glass Via (TGV) technology ...
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