AI infrastructure can't evolve as fast as model innovation. Memory architecture is one of the few levers capable of accelerating deployment cycles. Enter SOCAMM2 ...
JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls. Why AI and HPC compute scaling is outpacing ...
To meet the increasing demands of AI workloads, memory solutions must deliver ever-increasing performance in bandwidth, capacity, and efficiency. From the training of massive large language models ...
The debut of DeepSeek R1 sent ripples through the AI community, not just for its capabilities, but also for the sheer scale of its development. The 671-billion-parameter, open-source language model’s ...
SanDisk on Wednesday introduced an interesting new memory that could wed the capacity of 3D NAND and the extreme bandwidth enabled by high bandwidth memory (HBM). SanDisk's high-bandwidth flash (HBF) ...
Intel was the first of the major CPU makers to add HBM stacked DRAM memory to a CPU package, with the “Sapphire Rapids” Max Series Xeon SP processors. But with the “Granite Rapids” Xeon 6, Intel ...