Why it's essential to combine sign-off accuracy, iterative feedback, and intelligent automation in complex designs.
Skilled engineers remain the driving force for innovation in chips. But it’s no secret that electronic design automation (EDA) companies are folding AI into more of their offerings to speed up design ...
As the semiconductor industry continues its relentless march towards smaller process nodes and more complex integrated circuits (ICs), the challenge of ensuring reliability has become increasingly ...
Analog and mixed-signal (AMS) circuit design typically involves designing components like amplifiers, filters and data converters, which can be complex and time-consuming, often requiring manual ...
Due to the continuous expansion of China's mature process capacity and the ongoing requests from downstream customers for price reductions, the industry is very curious about the wafer pricing that IC ...
China has had a long history of supporting its semiconductor development with industrial policies. The "Outline for advancing the national IC industry" announced in 2014 upgraded semiconductors from a ...
Industry’s leading platform for creating differentiated custom silicon delivers unmatched productivity benefits with new generative AI technology Virtuoso Studio empowers designers to push ...
Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence (Nasdaq: CDNS) today announced it is ...
As the complexity of IC designs continues to grow, moving critical checks earlier in the design cycle helps designers identify and resolve issues before they escalate, streamlining the overall ...
A new software combines connectivity, scalability and data-driven artificial intelligence (AI) capabilities to push the boundaries of the IC verification process and make chip design teams more ...
Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology The Cadence Integrity ™ 3D-IC Platform now features enhanced support for improved ...
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