Path to Systems - No 3: This article provides insights into how the design and manufacturing process of system-in-package technology will extend Moore’s vision, creating Moore’s law 2.0.

IC packaging continues to play a big role in the development of new electronic products, particularly with system-in-package (SiP), a successful approach that continues to gain momentum — but mostly ...

The current trend in the electronics market is to seek solutions with ever-higher levels of integration at an ever lower cost. In this context, the System in Package (SiP) represents the ideal ...

The system-on-chip (SoC) is arguably the biggest misnomer of today’s electronics industry. The core integrated circuit may well have onboard much of the logic circuitry needed to support the needs of ...

Pune, India, Nov. 07, 2023 (GLOBE NEWSWIRE) -- Advent of 5G network in global market created lucrative opportunity for the market player to develop new line of electronics devices, having ...

A Tuesday report from Taiwan reiterated previous assertions that Apple would employ a new system-in-package design for the components in its so-called "iWatch," with production said to have begun on ...