KIOXIA America, Inc. today announced that it has begun shipping evaluation samples(1) of embedded flash memory compatible with the next-generation UFS standard, UFS 5.0, which is currently being ...

The key technical differences between JESD230G and earlier revisions of the NAND Flash Interoperability Standard. How the new Separate Command Address (SCA) Protocol improves performance by ...

Octal flash memory, or octal data transfer interface, utilizes eight data lines for input and output operations, resulting in significantly higher data transfer rates compared to serial, dual, and ...

With a slew of future manned and unmanned space missions on the horizon, Infineon Technologies AG has announced what is reportedly the industry’s first radiation-hardened-by-design 512 Mbit QSPI NOR ...

The persistent need for small-density memory in today’s market. Why embedded applications need small-density NOR flash memory. What are the best options for small-density NOR flash? Companies that ...

Flash memory has become one of the fastest growing semiconductor memories because of widespread adoption of this nonvolatile memory in portable electronics devices and consumer applications. Two major ...

Companies Preview 10th Generation 3D Flash Memory Technology Setting A New Benchmark for Performance, Power Efficiency and Bit Density Unveiled at ISSCC 2025, the new 3D flash memory innovation, ...

Spansion is also introducing today the first family of products based on this new interface, Spansion HyperFlash™ NOR Memory devices, with read throughput of up to 333 megabytes per second—more than ...

The Compute Express Link (CXL) has emerged as the dominant architecture for pooling and sharing connected memory devices. It was developed to support heterogeneous memory with different performance ...

Companies Preview 10 th Generation 3D Flash Memory Technology Setting A New Benchmark for Performance, Power Efficiency and Bit Density SAN FRANCISCO--(BUSINESS WIRE)--Kioxia Corporation and Sandisk ...