The post TSMC CEO Remains Confident as Intel Pushes Forward in Chip Manufacturing appeared first on Android Headlines.

Intel was first to market with backside power delivery.

Intel Corp. today showcased a new class of Intel Core Ultra X9 and X7 processors, the first new chips built on its most advanced 18A manufacturing process. Announced at the CES electronics trade show ...

A newly developed hydrogen-ion implanter highlights how Beijing is trying to plug one of the quiet but critical gaps in ...

A new cryogenic plasma etching technique developed by Japanese researchers dramatically accelerates semiconductor fabrication while cutting environmental impact, offering a potential breakthrough for ...

Intel CFO David Zinsner indicated that Intel is “prioritizing [its] internal wafer supply to data center” and having more of ...

TSMC’s dominance in advanced chip manufacturing has been good for consistency, but it also comes with downsides. When one company controls most of the cutting-edge process nodes, chipmakers have fewer ...

Driven by a plethora of benefits, data sharing is gradually becoming a “must have” for advanced device nodes and multi-die ...

Qualcomm is reportedly in talks with Samsung Electronics about contract manufacturing of next-generation 2nm chips, discussions that could support Samsung's efforts to revive its loss-making foundry ...