The performance of today’ electronic products relies heavily on the integrity of the tiny connections between microchips and circuits, which can number as many as 2,200. These bonds are tested ...

High-performance bonding materials like OEM-specified polyurethane and acrylic tapes are the ideal method when it comes to automotive attachment applications. Selecting the right tape for your ...

Wire bonding, a foundational process in microelectronics, is essential to establishing a robust and low-resistance electrical connection between semiconductor chips and their respective packages or, ...

Part of the HYAMP III series of manual ground-bond testers from Associated Research, the Model 3145 provides up to 40 A of DC ground-bond test current for alternative-energy and solar test ...

Dage Precision Industries at Productronica introduced an enhanced cold-bump-pull bond-testing capability as well as x-ray systems The new, second-generation cold-bump-pull (CBP) bond-testing ...